The burn-in machine is equipped with 72 independent drawers, each drawer supporting two test channels designed specifically for COB-type optical modules. This architecture enables high-density, parallel testing with stable thermal control and reliable electrical interfaces to ensure consistent burn-in performance across all units.
This burn-in machine is designed for 100G and 400G COB optical modules and can be customized specifically for COB. It provides stable thermal control, flexible electrical interfaces, and reliable long-duration burn-in conditions to ensure high-performance and consistent TO module reliability testing.
This burn-in machine is designed for 100G and 400G optical modules and can be customized specifically for TO-type devices. It provides stable thermal control, flexible electrical interfaces, and reliable long-duration burn-in conditions to ensure high-performance and consistent TO module reliability testing.
This machine is an all-in-one automated system integrating chip transferring (chip loading and unloading), optical modules (chips' optical pre-test and post-test) and burn-in systems. It able to reduce manual handling and production space requirements.